Production line "Future Packaging - Technologies,
Products, Visions
Again in 2012, Fraunhofer IZM will be exhibiting at the SMT trade fair in Nuremberg. As every year, the SMT/HYBRID/PACKAGING is the most important German event and an excellent opportunity to catch up with partners and customers from Germany and abroad.
This year again, ENGMATEC GmbH participates in the production line "Future Packaging" of Fraunhofer IZM. You can expect some technical highlights under the motto "Strong performance: from zero to production in three days".
For 14 years now the live manufacturing production line has been the biggest draw card of the Nürnberg SMT congress. Electric cars, the smart grid, LED lighting – cost-efficient manufacturing of power electronic assemblies is the challenge of the moment.17 leading technology and equipment suppliers will be on hand at the Future Packaging joint booth to demonstrate how this can be achieved using cutting-edge machines and technologies. Visitors will be treated to a close-up look at all stages of PCB placement on-site.
From May 3-5, 2011 Fraunhofer IZM will be presenting its entire range of services in the area of electronic packaging, smart system integration and reliability analyses. The booth’s exhibitors will be on hand to offer visitors more details about each of the production line’s processing steps.
Come and visit us in hall 6, booth 434, we are looking forward to seeing you!
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